Printed circuit board for transmitting signal in high-frequency band and electronic device including same

ABSTRACT

Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.

This application is the U.S. national phase of International ApplicationNo. PCT/KR2021/006125 filed 17 May 2021 which designated the U.S. andclaims priority to KR Patent Application No. 10-2020-0066626 filed 2Jun. 2020, the entire contents of each of which are hereby incorporatedby reference.

TECHNICAL FIELD

The disclosure relates to a printed circuit board for transmitting asignal of a high-frequency band and an electronic device including thesame.

BACKGROUND ART

Efforts are underway to develop a 5G communication system or a pre-5Gcommunication system to meet a growing demand for wireless data trafficafter the commercialization of 4G communication systems.

In order to achieve high data rates, it is possible to implement a 5Gcommunication system using various frequency bands. For example, alow-frequency band of 600 to 800 MHz, a mid-frequency band of 2.5 to 4.9GHz, or a high-frequency band of 24 GHz or higher may be used.

DISCLOSURE OF INVENTION Technical Problem

An electronic device implementing a 5G communication system may includea flexible circuit board that transmits a signal of a high-frequencyband. The flexible circuit board may include at least one signal linethat transmits a signal of a high-frequency band and a power line.

In the flexible circuit board, a conductive layer may include at leastone signal line and a power line. The thickness of the conductive layermay be designed in consideration of impedance matching of signal lines.For example, in the flexible circuit board, the thickness of the powerline is designed as the thickness of the signal lines, which may limitpower transmission of the power line.

Embodiments of the disclosure provide a flexible circuit board capableof reducing resistance of a power line while maintaining impedancematching so as to transmit a signal of a high-frequency band, and anelectronic device including the same.

Solution to Problem

According to an example embodiment of the disclosure, an electronicdevice may include a flexible circuit board configured to transmit asignal in a high-frequency band. The flexible circuit board may include:first multiple layers including a power line configured to transmitpower; and second multiple layers stacked in a first direction of thefirst multiple layers and including a first signal line and a secondsignal line configured to transmit a signal in the high-frequency band.The first multiple layers may include a first punched region in which atleast a portion overlapping the first signal line and the second signalline is removed, the second multiple layers may include a second punchedregion in which at least a portion overlapping the power line isremoved, and at least a portion of the second punched region and thefirst punched region overlap each other forming a slit penetrating theflexible circuit board in the first direction.

According to an example embodiment of the disclosure, a flexible circuitboard configured to transmit a signal in a high-frequency band mayinclude: first multiple layers including a power line configured totransmit power; and second multiple layers stacked in a first directionof the first multiple layers and including a first signal line and asecond signal line configured to transmit a signal in the high-frequencyband. The first multiple layers may include a first punched region inwhich at least a portion overlapping the first signal line and thesecond signal line is removed, the second multiple layers may include asecond punched region in which at least a portion overlapping the powerline is removed, and at least a portion of the second punched region andthe first punched region overlap each other forming a slit penetratingthe flexible circuit board in the first direction.

Advantageous Effects of Invention

With the flexible circuit board according to various example embodimentsof the disclosure, high-power transmission is enabled by increasing thethickness of the power line while maintaining impedance matching ofsignal lines.

With the flexible circuit board according to various example embodimentsof the disclosure, it is possible to facilitate a design for low heatgeneration due to a decrease in DC resistance of the power line.

With the flexible circuit board according to various example embodimentsof the disclosure, it is possible to design the lines of the signallines and the thickness of the power line have different thicknesses.Thus, it is easy to reduce the thickness of the signal lines, and it ispossible to manufacture the flexible circuit board in a thin shape.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing detailed description, taken in conjunction with theaccompanying drawings, in which:

FIG. 1 is a block diagram illustrating an example electronic device in anetwork environment according to various embodiments;

FIG. 2 is a block diagram illustrating an example electronic deviceconfigured to support legacy network communication and 5G networkcommunication according to various embodiments;

FIG. 3A is a perspective view of the third antenna module viewed fromone side according to various embodiments;

FIG. 3B is a perspective view of the third antenna module viewed from another side according to various embodiments;

FIG. 3C is a cross-sectional view of the third antenna module in takenalong line A-A′ according to various embodiments;

FIG. 4 is a diagram illustrating an example configuration of anelectronic device including the structure of the third antenna moduledescribed with reference to FIG. 2 according to various embodiments;

FIG. 5 is a cross-sectional view illustrating the flexible circuit boardtaken along line 5-5 in FIG. 4 according to various embodiments;

FIGS. 6A, 6B, 6C and 6D are cross-sectional views illustrating anexample method of manufacturing a flexible circuit board according tovarious embodiments;

FIG. 7 is a cross-sectional view of a flexible circuit board accordingto a comparative example;

FIG. 8 is a diagram illustrating a rear surface of a flexible circuitboard according to various embodiments;

FIG. 9 is a perspective view illustrating a rear surface of a flexiblecircuit board according to various embodiments;

FIG. 10 is a cross-sectional view of a flexible circuit board accordingto various embodiments;

FIG. 11 is a cross-sectional view of a flexible circuit board accordingto various embodiments;

FIG. 12 is a cross-sectional view of a flexible circuit board accordingto various embodiments; and

FIG. 13 is a cross-sectional view of a flexible circuit board accordingto various embodiments.

MODE FOR THE INVENTION

FIG. 1 is a block diagram illustrating an example electronic device 101in a network environment 100 according to various embodiments. Referringto FIG. 1 , the electronic device 101 in the network environment 100 maycommunicate with an electronic device 102 via a first network 198 (e.g.,a short-range wireless communication network), or an electronic device104 or a server 108 via a second network 199 (e.g., a long-rangewireless communication network). According to an embodiment, theelectronic device 101 may communicate with the electronic device 104 viathe server 108. According to an embodiment, the electronic device 101may include a processor 120, memory 130, an input device 150, a soundoutput device 155, a display device 160, an audio module 170, a sensormodule 176, an interface 177, a haptic module 179, a camera module 180,a power management module 188, a battery 189, a communication module190, a subscriber identification module (SIM) 196, or an antenna module197. In some embodiments, at least one (e.g., the display device 160 orthe camera module 180) of the components may be omitted from theelectronic device 101, or one or more other components may be added inthe electronic device 101. In some embodiments, some of the componentsmay be implemented as single integrated circuitry. For example, thesensor module 176 (e.g., a fingerprint sensor, an iris sensor, or anilluminance sensor) may be implemented as embedded in the display device160 (e.g., a display).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.According to an embodiment, as at least part of the data processing orcomputation, the processor 120 may load a command or data received fromanother component (e.g., the sensor module 176 or the communicationmodule 190) in volatile memory 132, process the command or the datastored in the volatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, the processor 120may include a main processor 121 (e.g., a central processing unit (CPU)or an application processor (AP)), and an auxiliary processor 123 (e.g.,a graphics processing unit (GPU), an image signal processor (ISP), asensor hub processor, or a communication processor (CP)) that isoperable independently from, or in conjunction with, the main processor121. Additionally or alternatively, the auxiliary processor 123 may beadapted to consume less power than the main processor 121, or to bespecific to a specified function. The auxiliary processor 123 may beimplemented as separate from, or as part of the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one component (e.g., the display device 160,the sensor module 176, or the communication module 190) among thecomponents of the electronic device 101, instead of the main processor121 while the main processor 121 is in an inactive (e.g., sleep) state,or together with the main processor 121 while the main processor 121 isin an active state (e.g., executing an application). According to anembodiment, the auxiliary processor 123 (e.g., an image signal processoror a communication processor) may be implemented as part of anothercomponent (e.g., the camera module 180 or the communication module 190)functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input device 150 may receive a command or data to be used by othercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputdevice 150 may include, for example, a microphone, a mouse, a keyboard,or a digital pen (e.g., a stylus pen).

The sound output device 155 may output sound signals to the outside ofthe electronic device 101. The sound output device 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record, and the receivermay be used for an incoming calls. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display device 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display device 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaydevice 160 may include touch circuitry adapted to detect a touch, orsensor circuitry (e.g., a pressure sensor) adapted to measure theintensity of force incurred by the touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 170 may obtainthe sound via the input device 150, or output the sound via the soundoutput device 155 or a headphone of an external electronic device (e.g.,an electronic device 102) directly (e.g., wiredly) or wirelessly coupledwith the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 176 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly (e.g., wiredly) orwirelessly. According to an embodiment, the interface 177 may include,for example, a high definition multimedia interface (HDMI), a universalserial bus (USB) interface, a secure digital (SD) card interface, or anaudio interface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). According to anembodiment, the connecting terminal 178 may include, for example, a HDMIconnector, a USB connector, a SD card connector, or an audio connector(e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 179 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment, the camera module 180 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to an embodiment, the power managementmodule 188 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, the battery 189 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more communicationprocessors that are operable independently from the processor 120 (e.g.,the application processor (AP)) and supports a direct (e.g., wired)communication or a wireless communication. According to an embodiment,the communication module 190 may include a wireless communication module192 (e.g., a cellular communication module, a short-range wirelesscommunication module, or a global navigation satellite system (GNSS)communication module) or a wired communication module 194 (e.g., a localarea network (LAN) communication module or a power line communication(PLC) module). A corresponding one of these communication modules maycommunicate with the external electronic device via the first network198 (e.g., a short-range communication network, such as Bluetooth™,wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA))or the second network 199 (e.g., a long-range communication network,such as a cellular network, the Internet, or a computer network (e.g.,LAN or wide area network (WAN)). These various types of communicationmodules may be implemented as a single component (e.g., a single chip),or may be implemented as multi components (e.g., multi chips) separatefrom each other. The wireless communication module 192 may identify andauthenticate the electronic device 101 in a communication network, suchas the first network 198 or the second network 199, using subscriberinformation (e.g., international mobile subscriber identity (IMSI))stored in the subscriber identification module 196.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, the antenna module197 may include an antenna including a radiating element including aconductive material or a conductive pattern formed in or on a substrate(e.g., PCB). According to an embodiment, the antenna module 197 mayinclude a plurality of antennas. In such a case, at least one antennaappropriate for a communication scheme used in the communicationnetwork, such as the first network 198 or the second network 199, may beselected, for example, by the communication module 190 (e.g., thewireless communication module 192) from the plurality of antennas. Thesignal or the power may then be transmitted or received between thecommunication module 190 and the external electronic device via theselected at least one antenna. According to an embodiment, anothercomponent (e.g., a radio frequency integrated circuit (RFIC)) other thanthe radiating element may be additionally formed as part of the antennamodule 197.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 101 and the external electronicdevice 104 via the server 108 coupled with the second network 199. Eachof the electronic devices 102 and 104 may be a device of a same type as,or a different type, from the electronic device 101. According to anembodiment, all or some of operations to be executed at the electronicdevice 101 may be executed at one or more of the external electronicdevices 102, 104, or 108. For example, if the electronic device 101should perform a function or a service automatically, or in response toa request from a user or another device, the electronic device 101,instead of, or in addition to, executing the function or the service,may request the one or more external electronic devices to perform atleast part of the function or the service. The one or more externalelectronic devices receiving the request may perform the at least partof the function or the service requested, or an additional function oran additional service related to the request, and transfer an outcome ofthe performing to the electronic device 101. The electronic device 101may provide the outcome, with or without further processing of theoutcome, as at least part of a reply to the request. To that end, acloud computing, distributed computing, or client-server computingtechnology may be used, for example.

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, a portable communication device (e.g., a smartphone), acomputer device, a portable multimedia device, a portable medicaldevice, a camera, a wearable device, a home appliance, or the like.According to an embodiment of the disclosure, the electronic devices arenot limited to those described above.

It should be appreciated that various embodiments of the disclosure andthe terms used therein are not intended to limit the technologicalfeatures set forth herein to particular embodiments and include variouschanges, equivalents, or replacements for a corresponding embodiment.With regard to the description of the drawings, similar referencenumerals may be used to refer to similar or related elements. It is tobe understood that a singular form of a noun corresponding to an itemmay include one or more of the things, unless the relevant contextclearly indicates otherwise. As used herein, each of such phrases as “Aor B,” “at least one of A and B,” “at least one of A or B,” “A, B, orC,” “at least one of A, B, and C,” and “at least one of A, B, or C,” mayinclude any one of, or all possible combinations of the items enumeratedtogether in a corresponding one of the phrases. As used herein, suchterms as “1st” and “2nd,” or “first” and “second” may be used to simplydistinguish a corresponding component from another, and does not limitthe components in other aspect (e.g., importance or order). It is to beunderstood that if an element (e.g., a first element) is referred to,with or without the term “operatively” or “communicatively”, as “coupledwith,” “coupled to,” “connected with,” or “connected to” another element(e.g., a second element), the element may be coupled with the otherelement directly (e.g., wiredly), wirelessly, or via a third element.

As used herein, the term “module” may include a unit implemented inhardware, software, or firmware, or any combination thereof, and mayinterchangeably be used with other terms, for example, “logic,” “logicblock,” “part,” or “circuitry”. A module may be a single integralcomponent, or a minimum unit or part thereof, adapted to perform one ormore functions. For example, according to an embodiment, the module maybe implemented in a form of an application-specific integrated circuit(ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 140) including one or more instructions that arestored in a storage medium (e.g., internal memory 136 or external memory138) that is readable by a machine (e.g., the electronic device 101).For example, a processor (e.g., the processor 120) of the machine (e.g.,the electronic device 101) may invoke at least one of the one or moreinstructions stored in the storage medium, and execute it, with orwithout using one or more other components under the control of theprocessor. This allows the machine to be operated to perform at leastone function according to the at least one instruction invoked. The oneor more instructions may include a code generated by a complier or acode executable by an interpreter. The machine-readable storage mediummay be provided in the form of a non-transitory storage medium. Wherein,the “non-transitory” storage medium is a tangible device, and may notinclude a signal (e.g., an electromagnetic wave), but this term does notdifferentiate between where data is semi-permanently stored in thestorage medium and where the data is temporarily stored in the storagemedium.

According to an embodiment, a method according to various embodiments ofthe disclosure may be included and provided in a computer programproduct. The computer program product may be traded as a product betweena seller and a buyer. The computer program product may be distributed inthe form of a machine-readable storage medium (e.g., compact disc readonly memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)online via an application store (e.g., PlayStore™), or between two userdevices (e.g., smart phones) directly. If distributed online, at leastpart of the computer program product may be temporarily generated or atleast temporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to various embodiments, each component (e.g., a module or aprogram) of the above-described components may include a single entityor multiple entities. According to various embodiments, one or more ofthe above-described components may be omitted, or one or more othercomponents may be added. Alternatively or additionally, a plurality ofcomponents (e.g., modules or programs) may be integrated into a singlecomponent. In such a case, according to various embodiments, theintegrated component may still perform one or more functions of each ofthe plurality of components in the same or similar manner as they areperformed by a corresponding one of the plurality of components beforethe integration. According to various embodiments, operations performedby the module, the program, or another component may be carried outsequentially, in parallel, repeatedly, or heuristically, or one or moreof the operations may be executed in a different order or omitted, orone or more other operations may be added.

FIG. 2 is a block diagram illustrating an electronic device 101 forsupporting legacy network communication and 5G network communicationaccording to various embodiments. Referring to FIG. 2 , the electronicdevice 101 may include a first communication processor 212, a secondcommunication processor 214, a first radio frequency integrated circuit(RFIC) 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, afirst radio frequency front end (RFFE) 232, a second RFFE 234, a firstantenna module 242, a second antenna module 244, and an antenna 248. Theelectronic device 101 may further include a processor 120 and a memory130. The network 199 may include a first network 292 and a secondnetwork 294. According to an embodiment, the electronic device 101 mayfurther include at least one component among the components illustratedin FIG. 1 , and the network 199 may further include at least onedifferent network. According to an embodiment, the first communicationprocessor 212, the second communication processor 214, the first RFIC222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, andthe second RFFE 234 may form at least a part of the wirelesscommunication module 192. According to an embodiment, the fourth RFIC228 may be omitted or included as a part of the third RFIC 226.

The first communication processor 212 may support establishment of acommunication channel in a band to be used for wireless communicationwith the first network 292, and legacy network communication through theestablished communication channel. According to various embodiments, thefirst network may be a legacy network including a 2G, 3G, 4G, or longterm evolution (LTE) network. The second communication processor 214 maysupport establishment of a communication channel corresponding to adesignated band (for example, about 6 GHz to about 60 GHz) among bandsto be used for wireless communication with the second network 294, and5G network communication through the established communication channel.According to various embodiments, the second network 294 may be a 5Gnetwork defined by third generation partnership project (3GPP).Additionally, according to an embodiment, the first communicationprocessor 212 or the second communication processor 214 may supportestablishment of a communication channel corresponding to anotherdesignated band (for example, about 6 GHz or lower) among the bands tobe used for wireless communication with the second network 294, and 5Gnetwork communication through the established communication channel.According to an embodiment, the first communication processor 212 andthe second communication processor 214 may be implemented inside asingle chip or a single package. According to various embodiments, thefirst communication processor 212 or the second communication processor214 may be formed inside a single chip or a single package together witha processor 120, an auxiliary processor 123, or a communication module190.

The first RFIC 222 may convert a baseband signal generated by the firstcommunication processor 212 into a radio frequency (RF) signal at about700 MHz to about 3 GHz, which is used for the first network 292 (forexample, legacy network), during transmission. During reception, an RFsignal may be acquired from the first network 292 (for example, legacynetwork) through an antenna (for example, the first antenna module 242),and may be preprocessed through an RFFE (for example, the first RFFE232). The first RFIC 222 may convert the preprocessed RF signal into abaseband signal such that the same can be processed by the firstcommunication processor 212.

The second RFIC 224 may convert a baseband signal generated by the firstcommunication processor 212 or the second communication processor 214into an RF signal in a Sub6 band (for example, about 6 GHz or lower)(hereinafter, referred to as a 5G Sub6 RF signal) that is used for thesecond network 294 (for example, 5G network). During reception, a 5GSub6 RF signal may be acquired from the second network 294 (for example,5G network) through an antenna (for example, the second antenna module244), and may be preprocessed through an RFFE (for example, the secondRFFE 234). The second RFIC 224 may convert the preprocessed 5G Sub6 RFsignal into a baseband signal such that the same can be processed by acommunication processor corresponding to the first communicationprocessor 212 or the second communication processor 214.

The third RFIC 226 may convert a baseband signal generated by the secondcommunication processor 214 into an RF signal in a 5G Above6 band (forexample, about 6 GHz to about 60 GHz) (hereinafter, referred to as a 5GAbove6 signal) that is to be used for the second network 294 (forexample, 5G network). During reception, a 5G Above6 RF signal may beacquired from the second network 294 (for example, 5G network) throughan antenna (for example, the antenna 248), and may be preprocessedthrough the third RFFE 236. The third RFIC 226 may convert thepreprocessed 5G Above6 signal into a baseband signal such that the samecan be processed by the second communication processor 214. According toan embodiment, the third RFFE 236 may be formed as a part of the thirdRFIC 226.

According to an embodiment, the electronic device 101 may include afourth RFIC 228 separately from the third RFIC 226 or as at least a partthereof. In this case, the fourth RFIC 228 may convert a baseband signalgenerated by the second communication processor 214 into an RF signal inan intermediate frequency band (for example, about 9 GHz to about 11GHz) (hereinafter, referred to as an IF signal) and then deliver the IFsignal to the third RFIC 226. The third RFIC 226 may convert the IFsignal into a 5G Above6 RF signal. During reception, a 5G Above6 RFsignal may be received from the second network 294 (for example, 5Gnetwork) through an antenna (for example, antenna 248) and convertedinto an IF signal by the third RFIC 226. The fourth RFIC 228 may convertthe IF signal into a baseband signal such that the same can be processedby the second communication processor 214.

According to an embodiment, the first RIFC 222 and the second RFIC 224may be implemented as at least a part of a single chip or a singlepackage. According to an embodiment, the first RFFE 232 and the secondRFFE 234 may be implemented as at least a part of a single chip or asingle package. According to an embodiment, at least one antenna moduleof the first antenna module 242 or the second antenna module 244 may beomitted or coupled to another antenna module so as to process RF signalin multiple corresponding bands.

According to an embodiment, the third RFIC 226 and the antenna 248 maybe arranged on the same substrate so as to form a third antenna module246. For example, the wireless communication module 192 or the processor120 may be arranged on a first substrate (for example, main PCB). Inthis case, the third RFIC 226 may be formed on a partial area (forexample, lower surface) of a second substrate (for example, sub PCB)that is separate from the first substrate, and the antenna 248 may bearranged in another partial area (for example, upper surface), therebyforming a third antenna module 246. The third RFIC 226 and the antenna248 may be arranged on the same substrate such that the length of thetransmission line between the same can be reduced. This may reduce loss(for example, attenuation) of a signal in a high-frequency band (forexample, about 6 GHz to about 60 GHz) used for 5G network communication,for example, due to the transmission line. Accordingly, the electronicdevice 101 may improve the quality or speed of communication with thesecond network 294 (for example, 5G network).

According to an embodiment, the antenna 248 may be formed as an antennaarray including multiple antenna elements that may be used forbeamforming. In this case, the third RFIC 226 may include multiple phaseshifters 238 corresponding to the multiple antenna elements, as a partof the third RFFE 236, for example. During transmission, each of themultiple phase shifters 238 may shift the phase of a 5G Above6 RFsignal, which is to be transmitted to the outside (for example, basestation of 5G network) of the electronic device 101, through acorresponding antenna element. During reception, each of the multiplephase shifters 238 may shift the phase of a 5G Above6 RF signal receivedfrom the outside into the same or substantially same phase through acorresponding antenna element. This enables transmission or receptionthrough beamforming between the electronic device 101 and the outside.

The second network 294 (for example, 5G network) may be operatedindependently of the first network 292 (for example, legacy network)(for example, standalone (SA)), or operated while being connectedthereto (for example, non-standalone (NSA)). For example, the 5G networkmay include only an access network (for example, 5G radio access network(RAN) or next-generation network (NG RAN)) and include no core network(for example, next-generation core (NGC)). In this case, the electronicdevice 101 may access the access network of the 5G network and thenaccess an external network (for example, Internet) under the control ofthe core network (for example, evolved packed core (EPC)) of the legacynetwork. Protocol information (for example, LTE protocol network) forcommunication with the legacy network or protocol information (forexample, new radio (NR) protocol information) for communication with the5G network may be stored in the memory 230, and may be accessed byanother component (for example, the processor 120, the firstcommunication processor 212, or the second communication processor 214).

FIGS. 3A, 3B and 3C illustrate an example of the third antenna module246 described with reference to FIG. 2 . FIG. 3A is a perspective viewof the third antenna module 246 viewed from one side, and FIG. 3B is aperspective view of the third antenna module 246 viewed from the otherside. FIG. 3C is a cross-sectional view of the third antenna module 246in taken along line A-A′.

Referring to FIGS. 3A, 3B and 3C, according to an embodiment, the thirdantenna module 246 may include a first printed circuit board 310, anantenna array 330, a radio-frequency integrated circuit (RFIC) 352, apower management integrated circuit (PMIC) 354, and a module interface(not illustrated). According to an embodiment, the third antenna module246 may further include a shield member (e.g., including a shieldingmaterial) 390. In various embodiments, at least one of theabove-mentioned components may be omitted, or at least two of thecomponents may be integrally formed.

The first printed circuit board 310 may include a plurality ofconductive layers and a plurality of non-conductive layers stackedalternately with the conductive layers. The first printed circuit board310 may provide electrical connection between various electroniccomponents disposed in the first printed circuit board 310 and/oroutside the first printed circuit board 310 using wiring lines andconductive vias formed in the conductive layers.

The antenna array 330 (e.g., 248 in FIG. 2 ) may include a plurality ofantenna elements 332, 334, 336, or 338 arranged to form directionalbeams. As illustrated, the antenna elements may be disposed on a firstsurface 310 a of the first printed circuit board 310. According to anembodiment, the antenna array 330 may be disposed inside the firstprinted circuit board 310. According to various embodiments, the antennaarray 330 may include a plurality of antenna arrays, which are differentor the same in shape or type (e.g., a dipole antenna array and/or apatch antenna array).

The RFIC 352 (e.g., 226 in FIG. 2 ) may be disposed in another region ofthe first printed circuit board 310 (e.g., a second surface 310 bopposite to the first side surface 310 a) spaced apart from the antennaarray. The RFIC may be configured to be capable of processing signals ina selected frequency band transmitted/received through the antenna array330. According to an embodiment, during transmission, the RFIC 352 mayconvert a baseband RF signal acquired from a communication processor(e.g., the second communication processor 214 in FIG. 2 ) into an RFsignal in a designated band. During reception, the RFIC 352 may convertan RF signal received through the antenna array 330 into a basebandsignal, and may transmit the baseband signal to a communicationprocessor.

According to an embodiment, during transmission, the RFIC 352 mayup-convert an IF signal (e.g., about 9 GHz to about 11 GHz) acquiredfrom an intermediate frequency integrated circuit (IFIC) (e.g., thefourth RFIC 228 in FIG. 2 ) into an RF signal of a selected band. Duringreception, the RFIC 352 may down-convert an RF signal acquired throughthe antenna array 330 into an IF signal and transmit the IF signal tothe IFIC.

The PMIC 354 may be arranged in another partial region (e.g., the secondsurface 310 b) of the first printed circuit board 310 spaced apart fromthe antenna array 330. The PMIC 354 may receive a voltage from a mainprinted circuit board (e.g., the second printed circuit board 430 inFIG. 4 ), and may provide required power for various components (e.g.,the RFIC 352) on the antenna module.

The shield member 390 may be arranged on a portion (e.g., the secondsurface 310 b) of the first printed circuit board 310 so as toelectromagnetically shield at least one of the RFIC 352 or the PMIC 354.According to an embodiment, the shield member 390 may include a shieldcan.

Although not illustrated, in various embodiments, the third antennamodule 246 may be electrically connected to another printed circuitboard (e.g., the second printed circuit board 430 in FIG. 4 ) via amodule interface. The module interface may include a connecting member,such as a coaxial cable connector, a board-to-board connector, aninterposer, or a flexible printed circuit board (FPCB). Through theconnecting member, the RFIC 352 and/or the PMIC 354 of the antennamodule may be electrically connected to the main printed circuit board(e.g., the second printed circuit board 430 in FIG. 4 ).

In various embodiments, the electronic device (e.g., the electronicdevice 101 in FIG. 1 ) may include an single third antenna module 246 ora plurality of third antenna modules 246.

An electronic device according to various example embodiments of thedisclosure (e.g., the electronic device 101 in FIG. 1 ) may include: aflexible circuit board (e.g., the flexible circuit board 410 in FIG. 5 )configured to transmit a signal in a high-frequency band. The flexiblecircuit board may include first multiple layers (e.g., the firstmultiple layers 510 in FIG. 5 ) including a power line (e.g., the powerline 5121 in FIG. 5 ) configured to transmit power, and second multiplelayers stacked in a first direction of the first multiple layers andincluding a first signal line (e.g., the first signal line 5221 in FIG.5 ) and a second signal line (e.g., the second signal line 5222 in FIG.5 ) configured to transmit a signal in the high-frequency band, thefirst multiple layers may include a first punched region (e.g., thefirst punched region 631 in FIG. 6C) in which at least a portionoverlapping the first signal line and the second signal line is removed,the second multiple layers may include a second punched region (e.g.,the second punched line 632 in FIG. 6C) in which at least a portionoverlapping the power line is removed, and at least a portion of thesecond punched region and the first punched region overlap each otherforming a slit (e.g., the first slit 531 or the second slit 532 in FIG.6C) penetrating the flexible circuit board in the first direction.

According to various example embodiments of the disclosure, the firstmultiple layers may include: a first insulating layer; a first upperconductive layer disposed in the first direction from the firstinsulating layer and including the power line; and a first lowerconductive layer disposed in a second direction opposite the firstdirection from the first insulating layer and including a first lowerground.

According to various example embodiments of the disclosure, the secondmultiple layers may include: a second insulating layer; a second upperconductive layer disposed in the first direction from the secondinsulating layer and including the first signal line and the secondsignal line; and a second lower conductive layer disposed in the seconddirection from the second insulating layer and including a second lowerground.

According to various example embodiments of the disclosure, a thicknessof the first upper conductive layer may be greater than a thickness ofthe second upper conductive layer wherein a thickness of the power lineis greater than the thicknesses of the first signal line and the secondsignal line.

According to various example embodiments of the disclosure, thethickness of the first lower conductive layer including the first lowerground may be greater than the thickness of the second lower conductivelayer including the second lower ground.

According to various example embodiments of the disclosure, thethickness of the first insulating layer may be less than the thicknessof the second insulating layer wherein an entire thickness of the firstmultiple layers is equal to an entire thickness of the second multiplelayers.

According to various example embodiments of the disclosure, the secondupper conductive layer may further include: a plurality of first groundpatterns provided at intervals on opposite sides of the first signalline, and a plurality of second ground patterns provided at intervals onopposite sides of the second signal line.

According to various example embodiments of the disclosure, the secondmultiple layers may further include: a plurality of first viaspenetrating the second insulating layer and electrically connecting theplurality of first ground patterns and the second lower ground; and aplurality of second vias penetrating the second insulating layer andelectrically connecting the plurality of second ground patterns and thesecond lower ground.

According to various example embodiments of the disclosure, the secondmultiple layers may further include: a cover layer disposed in the firstdirection from the second upper conductive layer and covering the firstsignal line and the second signal line; and a shield film disposed inthe first direction from the cover layer and electrically connected tothe plurality of first ground patterns and the plurality of secondground patterns by the conductive member.

According to various example embodiments of the disclosure, the flexiblecircuit board may include a first surface facing the first direction anda second surface facing away from the first surface, and the slit may beprovided between the power line and the first signal line and/or betweenthe power line and the second signal line when the first surface isviewed from above.

According to various example embodiments of the disclosure, the powerline may be disposed between the first signal line and the second signalline when the first surface is viewed from above.

According to various example embodiments of the disclosure, the secondsignal line may be disposed between the first signal line and the powerline when the first surface is viewed from above.

According to various example embodiments of the disclosure, a flexiblecircuit board (e.g., the flexible circuit board 410 in FIG. 5 )configured to transmit a signal in a high-frequency band may include:first multiple layers including a power line configured to transmitpower; and second multiple layers stacked in a first direction of thefirst multiple layers and including a first signal line and a secondsignal line configured to transmit a signal in the high-frequency band.The first multiple layers may include a first punched region in which atleast a portion overlapping the first signal line and the second signalline is removed, the second multiple layers may include a second punchedregion in which at least a portion overlapping the power line isremoved, and at least a portion of the second punched region and thefirst punched region overlap each other forming a slit penetrating theflexible circuit board in the first direction.

According to various example embodiments of the disclosure, the firstmultiple layers may include: a first insulating layer; a first upperconductive layer disposed in the first direction from the firstinsulating layer and including the power line; and a first lowerconductive layer disposed in a second direction opposite the firstdirection from the first insulating layer and including a first lowerground.

According to various example embodiments of the disclosure, the secondmultiple layers may include: a second insulating layer; a second upperconductive layer disposed in the first direction from the secondinsulating layer and including the first signal line and the secondsignal line; and a second lower conductive layer disposed in the seconddirection from the second insulating layer and including a second lowerground.

According to various example embodiments of the disclosure, a thicknessof the first upper conductive layer may be greater than a thickness ofthe second upper conductive layer wherein a thickness of the power lineis greater than the thicknesses of the first signal line and the secondsignal line.

According to various example embodiments of the disclosure, thethickness of the first lower conductive layer including the first lowerground may be greater than the thickness of the second lower conductivelayer including the second lower ground.

According to various example embodiments of the disclosure, thethickness of the first insulating layer may be less than the thicknessof the second insulating layer wherein an entire thickness of the firstmultiple layers is equal to an entire thickness of the second multiplelayers.

According to various example embodiments of the disclosure, the secondupper conductive layer may further include: a plurality of first groundpatterns provided at intervals on opposite sides of the first signalline, and a plurality of second ground patterns provided at intervals onopposite sides of the second signal line.

According to various example embodiments of the disclosure, the secondmultiple layers may further include: a plurality of first viaspenetrating the second insulating layer and electrically connecting theplurality of first ground patterns and the second lower ground; and aplurality of second vias penetrating the second insulating layer andelectrically connecting the plurality of second ground patterns and thesecond lower ground.

FIG. 4 is a diagram illustrating an example configuration of anelectronic device 101 including the structure of the third antennamodule 246 described with reference to FIG. 2 according to variousembodiments. The electronic device 101 illustrated in FIG. 4 may furtherinclude an embodiment in which the electronic device 101 may be at leastpartially similar to or different from the electronic device 101 of FIG.1 . FIG. 4 may be a view illustrating the state in which a rear cover(or a rear plate) (not illustrated) of the electronic device 101 isremoved.

Referring to FIG. 4 , 5G antenna modules may be disposed adjacent to afirst side surface 401 of the electronic device 101 according to anembodiment. For example, the 5G antenna modules may include a first 5Gmodule 431 configured to communicate with a 5G network (e.g., the secondnetwork 294 in FIG. 2 ), or a WiFi antenna module 441 configured toaccess a WiFi network based on 802.11ay. According to an embodiment, thefirst 5G module 431 may be the same as or at least partially similar tothe third antenna module 246 illustrated in FIGS. 3A, 3B and 3C.

According to an embodiment, the first 5G antenna module 431 and/or theWiFi antenna module 441 disposed on the first side surface 401 of theelectronic device 101 may be electrically connected to a second printedcircuit board 430 (e.g., the second printed circuit board 430 in FIG. 4) via the first flexible circuit board 410.

According to an embodiment, the second printed circuit board 430 may bea main printed circuit board. According to an embodiment, at least aportion of the second printed circuit board 430 may be disposed adjacentto the third antenna module 246 illustrated in FIGS. 3A, 3B and 3C, andmay be electrically connected to the third antenna module 246 via aconnecting member (e.g., the connector (not illustrated)).

According to an embodiment, the first flexible circuit board 410 mayinclude a plurality of signal lines (e.g., the first signal line 5221and the second signal line 5222 in FIG. 5 ) configured to transmit asignal in a high-frequency band (e.g., 10 GHz to 100 GHz). According toan embodiment, the plurality of signal lines 5221 and 5222 may betransmission lines configured to transmit a signal in a high-frequencyband (e.g., a band of an interface (IF) frequency of about 9 GHz to 10GHz/RF radiation frequency of about 24 GHz to 28 GHz or 39 GHz).

According to an embodiment, the plurality of signal lines 5221 and 5222may be a transmission line configured to transmit a signal in ahigh-frequency band (e.g., a band of an interface (IF) frequency ofabout 18 GHz/an RF emission frequency of an about 60 GHz band) based on802.11ay.

According to an embodiment, the first flexible circuit board 410 mayinclude at least one low-speed signal control wiring line (e.g., thelow-speed control signal wiring line 5121 in FIG. 5 ) configured totransmit a low-speed control signal such as power (e.g., VBAT), a clock(e.g., CLK), or data (e.g., DATA). For example, the first multiplelayers 510 may include a power line (e.g., the power line 5121 in FIG. 5), and may further include at least one low-speed control signal line(not illustrated) provided on a layer different from that of the powerline.

According to an embodiment, one or more slits 531 and 532 may be formedon the first flexible circuit board 410. For example, the first flexiblecircuit board 410 may include a first slit 531 and a second slit 532.According to an embodiment, the first slit 531 and the second slit 532may be formed by removing at least a portion of the first flexiblecircuit board 410. According to an embodiment, the first slit 531 andthe second slit 532 may be formed along the direction in which the firstflexible circuit board 410 is formed (e.g., the length direction of thefirst flexible circuit board 410).

According to an embodiment, another 5G antenna module may be disposedadjacent to the second side surface 402 opposite to the first sidesurface 401 of the electronic device 101. For example, a second 5Gmodule 432 configured to communicate with a 5G network (e.g., the secondnetwork 294 in FIG. 2 ) may be disposed on the second side surface 402of the electronic device 101.

According to an embodiment, the second 5G module 432 may be electricallyconnected to the second printed circuit board 430 via the secondflexible circuit board 420. In an embodiment, the second flexiblecircuit board 420 may include a structure that is the same as or similarto the first flexible circuit board 410. For example, the secondflexible circuit board 420 may include a first slit 531 and a secondslit 532 like the first flexible circuit board 410.

The second flexible circuit board 420 may include a plurality of signallines 5221 and 5222 configured to transmit a signal in a high-frequencyband (e.g., 10 GHz to 100 GHz). The second 5G module 432 may be the sameas or at least partially similar to the third antenna module 246illustrated in FIGS. 3A, 3B and 3C. In various embodiments, the secondflexible circuit board 420 may further include at least one low-speedsignal wiring line 5121 configured to transmit a low-speed controlsignal such as power (e.g., VBAT), a clock (e.g., CLK), or data (e.g.,DATA).

FIG. 5 is a cross-sectional view illustrating a cross section of theflexible circuit board 410 taken along line 5-5 in FIG. 4 according tovarious embodiments. For example, FIG. 5 may be a view illustrating across section obtained by cutting a portion of the first flexiblecircuit board 410 illustrated in FIG. 4 .

Referring to FIG. 5 , a flexible circuit board 410 according to anembodiment may include a power line 5121 configured to transmit power,and a first signal line 5221 and a second signal line 5222 configured totransmit a high-frequency band signal (e.g., 10 GHz to 100 GHz).According to various embodiments, the number of signal lines 5221 and5222 and the number of power lines 5121 of the flexible circuit board410 may be variously changed.

According to an embodiment, the first signal line 5221 and the secondsignal line 5222 may be formed on the same layer, and the first signalline 5221 (or the second signal line 5222) and the power line 5121 maybe formed on different layers 510 and 520. For example, the power line5121 may be formed in the first multiple layers 510 of the flexiblecircuit board 410, and the first signal line 5221 and the second signalline 5222 may be formed in the second multiple layers 520 of theflexible circuit board 410.

According to an embodiment, the flexible circuit board 410 may includefirst multiple layers 510 including the power line 5121, and secondmultiple layers 520 including the first signal line 5221 and the secondsignal line 5222. According to an embodiment, the second multiple layers520 may be formed by being stacked in the first direction {circle around(1)} of the first multiple layers 510 (e.g., the upward direction inFIG. 5 ).

According to an embodiment, the second multiple layers 520 may bedisposed substantially parallel to the first multiple layers 510.

According to an embodiment, the power line 5121 may be disposed betweenthe first signal line 5221 and the second signal line 5222. For example,the first signal line 5221 may be disposed in one direction of the powerline 5121 (e.g., the left direction in FIG. 5 ), and the second signalline 5222 may be disposed in the other direction of the power line 5121(e.g., the right direction in FIG. 5 ).

According to an embodiment, slits 530 may be formed between the firstsignal line 5221 and the second signal line 5222 and the power line5121. For example, a first slit 531 may be formed between the firstsignal line 5221 and the power line 5121, and a second slit 532 may beformed between the second signal line 5222 and the power line 5121.According to an embodiment, the first slit 531 and the second slit 532may be formed by removing a portion of the first multiple layers 510 anda portion of the second multiple layers 520 overlapping therewith. Forexample, the first slit 531 and the second slit 532 may be formed to atleast partially penetrate boundary portions between the first signalline 5221 and the second signal line 5222 and the power line 5121 in theflexible circuit board 410.

According to an embodiment, the first slit 531 and the second slit 532may be formed through a punching process of removing a portion of thefirst multiple layers 510 and a punching process of removing a portionof the second multiple layers 520. The punching processes will bedescribed in greater detail below with reference to FIGS. 6A, 6B, 6C and6D.

Hereinafter, the stacked structure of the flexible circuit board 410according to an embodiment will be described in greater detail.

According to an embodiment, the first multiple layers 510 may include afirst insulating layer 511, a first upper conductive layer 512 formed inthe first direction {circle around (1)} from the first insulating layer511, and a first lower conductive layer 513 formed in the seconddirection {circle around (2)} opposite to the first direction {circlearound (1)} from the first insulating layer 511 (e.g., the downwarddirection in FIG. 5 ). According to an embodiment, the first upperconductive layer 512 may include a power line 5121. According to anembodiment, the first lower conductive layer 513 may include a firstlower ground 5131.

According to an embodiment, the second multiple layers 520 may include asecond insulating layer 521, a second upper conductive layer 522 formedin the first direction {circle around (1)} from the second insulatinglayer 521, and a second lower conductive layer 523 formed in the seconddirection {circle around (2)} from the second insulating layer 521.

According to an embodiment, the second upper conductive layer 522 mayinclude a first signal line 5221 and a second signal line 5222.

According to an embodiment, the second upper conductive layer 522 mayfurther include first ground patterns 5223 spaced apart from the firstsignal line 5221 and disposed on opposite sides of the first signal line5221. For example, a plurality of first ground patterns 5223 may beformed at intervals on opposite sides of the first signal line 5221.

According to an embodiment, the second upper conductive layer 522 mayfurther include second ground patterns 5224 spaced apart from the secondsignal line 5222 and disposed on opposite sides of the second signalline 5222. For example, a plurality of second ground patterns 5224 maybe formed at intervals on opposite sides of the second signal line 5222.

According to an embodiment, in the second upper conductive layer 522, aninsulating material (e.g., cover layers (e.g., the cover layers 1112 inFIG. 11 )) may be formed in a region 5225 between the first signal line5221 and the first ground pattern 5223 and a region 5225 between thesecond signal line 5222 and the second ground pattern 5224.

According to an embodiment, the second lower conductive layer 523 mayinclude a second lower ground 5231. According to an embodiment, thesecond lower ground 5231 may be electrically connected to the firstground pattern 5223 and the second ground pattern 5224 through viaspenetrating through the second insulating layer 521. For example, thesecond multiple layers 520 may include a plurality of first vias 5211penetrating the second insulating layer 521 and electrically connectingthe plurality of first ground patterns 5223 and the second lower ground5231 to each other, and a plurality of second vias 5212 penetrating thesecond insulating layer 521 and electrically connecting the plurality ofsecond ground patterns 5224 and the second lower ground 5231 to eachother.

According to an embodiment, the thickness of the first multiple layers510 may be different from the thickness of the second multiple layers520. For example, the thickness D31 of the first insulating layer 511and the thickness D33 of the second insulating layer 521 may bedifferent. For example, the thickness D11 of the first upper conductivelayer 512 and the thickness D12 of the second upper conductive layer 522may be different. For example, the thickness D21 of the first lowerconductive layer 513 and the thickness D22 of the second lowerconductive layer 523 may be different.

According to an embodiment, the thickness D21 of the first lowerconductive layer 513 may be greater than the thickness D22 of the secondlower conductive layer 523.

According to an embodiment, the thickness D11 of the first upperconductive layer 512 including the power line 5121 may be greater thanthe thickness D12 of the second upper conductive layer 522 including thefirst signal line 5221 and the second signal line 5222. For example, thethickness D11 of the power line 5121 may be greater than the thicknessD12 of the first signal line 5221 and the second signal line 5222.

FIGS. 6A, 6B, 6C and 6D are cross-sectional views illustrating anexample method of manufacturing a flexible circuit board 410 accordingto various embodiments. For example, FIGS. 6A, 6B, 6C and 6D (which maybe referred to hereinafter as FIGS. 6A to 6D) may be cross-sectionalviews illustrating an example method of manufacturing the first flexiblecircuit board 410 illustrated in FIG. 5 .

Referring to FIG. 6A, a method of manufacturing a flexible circuit board410 according to an embodiment may include a first process of providinga flexible circuit board 410 including first multiple layers 510 andsecond multiple layers 520 stacked in a first direction {circle around(1)} from the first multiple layers 510. According to an embodiment, thefirst process may be a process of bonding (or attaching) the firstmultiple layers 510 to the second multiple layers 520. For example, atleast a portion of the first multiple layers 510 (e.g., an edge area (ora corner area) of the first multiple layers 510) may be bonded to thesecond multiple layers 520 via an adhesive member 610.

According to an embodiment, the adhesive member 610 may include one ormore of epoxy resin, acrylic resin, polyimide resin, and/ornitrile-butadien rubber.

According to an embodiment, in the first process, the first multiplelayers 510 may include a first insulating layer 511, a first upperconductive layer 512 formed in the first direction {circle around (1)}from the first insulating layer 511, and a first lower conductive layer513 formed in the second direction {circle around (2)} opposite to thefirst direction {circle around (1)} from the first insulating layer 511.

According to an embodiment, in the first process, the second multiplelayers 520 may include a second insulating layer 521, a second upperconductive layer 522 formed in the first direction {circle around (1)}from the second insulating layer 521, and a second lower conductivelayer 523 formed in the second direction {circle around (2)} from thesecond insulating layer 521.

According to an embodiment, before the first process, there may be a viaprocess of forming a plurality of first vias 5211 and a plurality ofsecond vias 5212 electrically connecting at least a portion of thesecond upper conductive layer 522 to the second lower conductive layer523.

Referring to FIG. 6B, the method of manufacturing the flexible circuitboard 410 according to an embodiment may include a second process offorming a first signal line 5221, a second signal line 5222, and a firstground pattern 5223, or a second ground pattern 5224 by patterning(e.g., etching) at least a portion of the second upper conductive layer522. For example, the second process may include a process of patterningperipheral portions 621, 622, and 623 of the first signal line 5221 andthe first ground pattern 5223 and peripheral portions 624, 625, and 626of the second signal line 5222 and the second ground pattern 5224 in thesecond upper conductive layer 522.

Referring to FIG. 6C, the method of manufacturing the flexible circuitboard 410 according to an embodiment may include a third process ofremoving at least a portion of the first multiple layers 510 and atleast a portion of the second multiple layers 520. According to anembodiment, the third process may include a first punching process ofremoving at least a portion of the first multiple layers 510, and asecond punching process of removing at least a portion of the secondmultiple layers 520.

According to an embodiment, in the first punching process, at least aportion that overlaps the first signal line 5221 and the second signalline 5222 may be removed from the first multiple layers 510. Accordingto an embodiment, portions of the first multiple layers 510 overlappingthe first signal line 5221 and the second signal line 5222 anddesignated regions (e.g., at least some regions corresponding to theslits 531 and 532 (hereinafter, referred to as “slit regions”)) may bedefined as first punched regions 631, and the portions defined as thefirst punched regions 631 may be removed through a first punchingprocess. For example, the first punched regions 631 may be regions ofthe first multiple layers 510 overlapping the first signal line 5221 andthe second signal line 5222 and designated regions (e.g., the regions ofthe slits 531 and 532), and may be regions removed through the firstpunching process.

According to an embodiment, in the first punching process, the remainingportions except for the portion of the first multiple layers 510 inwhich the power line 5121 is formed and a portion of the flexiblecircuit board 410 connected to a connector (not illustrated) (e.g., theportions overlapping the first signal line 5221 and the second signalline 5222) may be removed.

According to an embodiment, in the second punching process, at least aportion overlapping the power line 5121 may be removed. According to anembodiment, the portions of the second multiple layers 520 overlappingthe power line 5121 and designated regions (e.g., at least some regionscorresponding to the slits 531 and 532 (hereinafter, referred to as“slit regions”)) may be defined as second punched regions 632, and theportions defined as the second punched regions 632 may be removedthrough a second punching process. For example, the second punchedregions 632 may be regions of the second multiple layers 520 overlappingthe power line 5121 and designated regions (e.g., the regions of theslits 531 and 532), and may be regions removed through the secondpunching process.

According to an embodiment, through the second multiple layers 520, theportions other than the portions in which the first signal line 5221,the first ground pattern 5223, the second signal line 5222, and thesecond ground pattern 5224 are formed and the portion of the flexiblecircuit board 410 to be connected to a connector (not illustrated)(e.g., a portion overlapping the power line 5121) may be removed fromthe second multiple layers 520.

According to an embodiment, at least a part of the second punchedregions 632 and the first punched regions 631 overlap each other, andthus the slits 531 and 532 may be formed. For example, the portions ofthe second punching regions 632 overlapping the first punching regions631 may form the slits 531 and 532 that at least partially penetrate theflexible circuit board 410 in the first direction {circle around (1)} orthe second direction {circle around (2)}. According to an embodiment,the slits 531 and 532 may include a first slit 531 penetrating theflexible circuit board 410 between the first signal line 5221 and thepower line 5121 and a second slit 532 at least partially penetrating theflexible circuit board 410 between the second signal line 5222 and thepower line 5121.

Referring to FIG. 6D, the method of manufacturing the flexible circuitboard 410 according to an embodiment may be completed by disposing theportion in which the power line 5121 is formed in the first multiplelayers 510 in the second punched region (e.g., the second punched region632 of FIG. 6C) of the second multiple layers 520. For example, sincethe flexible circuit board 410 is very thin and has a flexiblecharacteristic, the portion where the power line 5121 is formed ismovable in the first direction {circle around (1)} as indicated by thearrow 640 in FIG. 6D. Accordingly, in the finally completed flexiblecircuit board 410, the power line 5121, the first signal line 5221and/or the second signal line 5222 may be disposed substantiallyparallel to each other.

According to an embodiment, a portion of the flexible circuit board 410to be connected to a connector (not illustrated) may not be removedthrough the process of punching the second punched region 632 of thesecond multiple layers 520. For example, in the portion of the flexiblecircuit board 410 to be connected to a connector (not illustrated), theportion in which the power line 5121 of the first multiple layers 510 isformed in the second punched region 632 may not be disposed.

FIG. 7 is a cross-sectional view of a flexible circuit board 700according to a comparative example.

Referring to FIG. 7 , the flexible circuit board 700 according to ancomparative example may include an insulating layer 710, an upperconductive layer 720 formed in the first direction {circle around (1)}from the insulating layer 710, and a lower conductive layer 730 formedin the second direction {circle around (2)} opposite to the firstdirection {circle around (1)} from the insulating layer 710.

According to the comparative example, the upper conductive layer 720 mayinclude a power line 721, a first signal line 722, a second signal line723, first ground patterns 724, and second ground patterns 725. In thecomparative example, the power line 721 may be formed between the firstsignal line 722 and the second signal line 723. In the comparativeexample, the first ground patterns 724 may be formed on opposite sidesof the first signal line 722, and second ground patterns 725 may bedisposed on opposite sides of the second signal line 723. In thecomparative example, the first ground patterns 724 and the lowerconductive layer 730 may be electrically connected to each other viafirst vias 711 penetrating the insulating layer 710, and the secondground patterns 725 and the lower conductive layer 730 may beelectrically connected to each other via second vias 712 penetrating theinsulating layer 710.

According to the comparative example, since the power line 721, thefirst signal line 722, and the second signal line 723 are formed on thesame layer, all of them may have the same thickness. In the flexiblecircuit board 410 according to the comparative example, the thickness ofthe upper conductive layer 720 may be designed to have a thicknessdesignated for impedance matching of the first signal line 722 and thesecond signal line 723 (e.g., 50 ohm (Ω) impedance matching), and thusthe thickness of the power line 721 may be designed in consideration ofimpedance matching of the first signal line 722 and the second signalline 723.

In the flexible circuit board 700 according to the comparative example,when the thickness of the upper conductive layer 720 including the powerline is increased in order to reduce the resistance of the power line721 as indicated by the arrow 742 in FIG. 7 , impedance mismatching mayoccur in the first signal line 722 and the second signal line 723.

In the flexible circuit board 410 according to the comparative example,increasing the width of the power line 721 as indicated by the arrow 741in FIG. 7 may increase the overall width of the flexible circuit board410.

Meanwhile, in the flexible circuit board 410 according to an embodimentof the disclosure described with reference to FIG. 5 to and FIGS. 6A to6D, since the layers in which the first signal line 5221 and the secondsignal line 5222 are formed (e.g., the second multiple layers 520) andthe layers in which the power line 5121 is formed (e.g., the firstmultiple layers 510) are separated, it is easy to reduce the resistanceof the power line 5121 by designing the power line 5121 to have a greatthickness. For example, in the flexible circuit board 410 according toan embodiment of the disclosure, it is possible to reduce the resistanceby designing the thickness of the power line 5121 to be greater thanthat of the power line according to the comparative example illustratedin FIG. 7 while maintaining impedance matching by maintaining thethickness of the first signal line 5221 and the second signal line 5222to be the same as the thickness of the first signal 722 and the secondsignal line 723 according to the comparative example illustrated in FIG.7 .

FIG. 8 is a diagram illustrating a rear surface of a flexible circuitboard 410 according to various embodiments. FIG. 9 is a perspective viewillustrating a rear surface of a flexible circuit board 410 according tovarious embodiments.

For example, FIGS. 8 and 9 include enlarged views of the rear surface ofthe first flexible circuit board 410 illustrated in FIG. 4 or FIG. 5 ora portion thereof. The flexible circuit board 410 illustrated in FIGS. 8and 9 may be at least partially similar to or different from the firstflexible circuit board 410 illustrated in FIG. 4 or the flexible circuitboard 410 shown in FIG. 5 , or may further include various embodiments.

Hereinafter, the portions not described with reference to FIGS. 4 and 5will be described with reference to FIGS. 8 and 9 .

Referring to FIGS. 8 and 9 , the flexible circuit board 410 according toan embodiment of the disclosure may include a ground mesh structure 810for impedance matching (e.g., 50 ohm (Ω) impedance matching) of thefirst signal line 5221 and the second signal line 5222.

According to an embodiment, the flexible circuit board 410 may include afirst surface facing the first direction {circle around (1)} (e.g., thefirst surface 901 in FIG. 9 ) and a second surface opposite to the firstsurface 901 (e.g., the second surface 902 in FIGS. 8 and 9 ). Theexample illustrated in FIG. 8 may be a view of the second surface 902 ofthe flexible circuit board 410 viewed from above.

According to an embodiment, the flexible circuit board 410 may includefirst multiple layers (e.g., the first multiple layers 510 in FIG. 5 )including the power line 5121, and second multiple layers (e.g., thesecond multiple layers 520 in FIG. 5 ) including the first signal line5221 and the second signal line 5222.

According to an embodiment, the power line 5121 may be disposed betweenthe first signal line 5221 and the second signal line 5222. According toan embodiment, a first slit 531 may be formed between the power line5121 and the first signal line 5221, and a second slit 532 may be formedbetween the power line 5121 and the second signal line 5222. Accordingto an embodiment, the first slit 531 and the second slit 532 are formedto penetrate both the first multiple layers 510 and the second multiplelayers 520, and may be arranged in the direction in which the power line5121 is formed.

For example, a plurality of first vias 5211 may be formed at intervalson opposite sides of the first signal line 5221. According to anembodiment, a plurality of second vias 5212 may be formed at intervalson opposite sides of the second signal line 5222.

According to an embodiment, the power line 5121 may be formed on thefirst upper conductive layer 512 of the first multiple layers 510, and afirst lower conductive layer 513 may be formed in the second direction{circle around (2)} from the first upper conductive layer 512. Forexample, the first lower conductive layer 513 may be disposed to facethe second surface of the flexible circuit board 410. According to anembodiment, the first lower conductive layer 513 may include a firstlower ground 5131.

According to an embodiment, the first signal line 5221 and the secondsignal line 5222 may be formed on the second upper conductive layer(e.g., the second upper conductive layer 522 in FIG. 5 ) of the secondmultiple layers 520, and a second lower conductive layer (e.g., thesecond lower conductive layer 523 in FIG. 5 ) may be formed in thesecond direction {circle around (2)} from the second upper conductivelayer 512. According to an embodiment, the second lower conductive layer523 may include a second lower ground 5231.

According to an embodiment, the second lower ground 5231 may include aground mesh structure 810 for impedance matching (e.g., 50 ohm (Ω)impedance matching) of the first signal line 5221 and the second signalline 5222.

According to an embodiment, the ground mesh structure 810 may include aplurality of openings 812 and a plurality of bridges 811 formed along adirection in which the first signal line 5221 and the second signal line5222 are arranged.

According to an embodiment, the plurality of openings 812 may be regionsin each of which a portion of the second conductive layer 523 is removedso that at least a portion of the first signal line 5221 or at least aportion of the second signal line 5222 is exposed. According to anembodiment, the plurality of openings 812 may be formed at intervalsalong the direction in which the first signal line 5221 and the secondsignal line 5222 are arranged.

According to an embodiment, the plurality of bridges 811 may be regionseach of which crosses the first signal line 5221 or the second signalline 5222 between the plurality of openings 812. According to anembodiment, the plurality of bridges 811 may be formed at intervalsalong the direction in which the first signal line 5221 and the secondsignal line 5222 are arranged.

According to an embodiment, the openings 812 and the bridges 811 may bealternately formed. For example, a bridge 811 may be disposed betweenadjacent openings 812, and an opening 812 may be formed between adjacentbridges 811.

FIG. 10 is a cross-sectional view of a flexible circuit board 410according to various embodiments.

The flexible circuit board 410 illustrated in FIG. 10 may be at leastpartially similar to or different from the first flexible circuit board410 illustrated in FIG. 5 , or may further include various embodiments.

Hereinafter, portions that have changed from the embodiment of FIG. 5will be described with reference to FIG. 10 . In FIG. 10 , the samereference numerals are used for the same components as those of FIG. 5 ,and for the descriptions of the same reference numerals, the descriptionmade with reference to FIG. 5 will be used instead.

Referring to FIG. 10 , in the flexible circuit board 410, as indicatedby the arrow 1001 of FIG. 10 , the thickness of the first multiplelayers 510 and the thickness of the second multiple layers 520 may bemade equal to each other by adjusting the thickness D34 of the firstinsulating layer 511.

According to an embodiment, in the flexible circuit board 410, thethickness D34 of the first insulating layer 511 may be smaller than thethickness D33 of the second insulating layer 521 so that the entirethickness of the first multiple layers 510 substantially equals theentire thickness of the second multiple layers 520.

According to an embodiment, the thickness D11 of the power line 5121 maybe greater than the thickness D12 of the first signal line 5221 and thesecond signal line 5222, but the entire thickness of the first multiplelayers 510 may substantially equal the entire thickness of the secondmultiple layers 520.

FIG. 11 is a cross-sectional view of a flexible circuit board 410according to various embodiments. The flexible circuit board 410illustrated in FIG. 11 may be at least partially similar to or differentfrom the flexible circuit board 410 illustrated in FIG. 5 , or mayfurther include various embodiments.

Hereinafter, portions that have changed from the embodiment of FIG. 5will be described with reference to FIG. 11 . In FIG. 11 , the samereference numerals are used for the same components as those of FIG. 5 ,and for the descriptions of the same reference numerals, the descriptionmade with reference to FIG. 5 will be used instead.

Referring to FIG. 11 , the flexible circuit board 410 may furtherinclude cover layers 1111, 1112, 1121, and/or 1122 and a shield film1141.

According to an embodiment, the first multiple layers 510 may furtherinclude cover layers 1111 and 1121. For example, in the first multiplelayers 510, a first upper cover layer 1111 may be formed in the firstdirection {circle around (1)} from the first upper conductive layer 512,and a first lower cover layer 1121 may be formed in the second direction{circle around (2)} from the first lower conductive layer 513.

According to an embodiment, the second multiple layers 520 may furtherinclude cover layers 1112 and 1122. For example, in the second multiplelayers 520, a second upper cover layer 1112 may be formed in the firstdirection {circle around (1)} from the second upper conductive layer522, and a second lower cover layer 1111 may be formed in the seconddirection {circle around (2)} from the second lower conductive layer523. According to an embodiment, the second upper cover layer 1112 maybe formed to cover the first signal line 5221 and the second signal line5222.

According to an embodiment, the second multiple layers 520 may furtherinclude a shield film 1141. For example, in the second multiple layers520, a shield film 1141 may be further formed in the first direction{circle around (1)} from the second upper cover layer 1112. According toan embodiment, the shield film 1141 may be electrically connected to thefirst ground pattern 5223 or the second ground pattern 5224 via theconductive member 1131. According to an embodiment, the shield film mayinclude an electromagnetic interference (EMI) film.

FIG. 12 is a cross-sectional view of a flexible circuit board 410according to various embodiments.

The flexible circuit board 410 illustrated in FIG. 12 may be at leastpartially similar to or different from the flexible circuit board 410illustrated in FIG. 5 , or may further include various embodiments.

Hereinafter, portions that have changed from the embodiment of FIG. 5will be described with reference to FIG. 12 . In FIG. 12 , the samereference numerals are used for the same components as those of FIG. 5 ,and for the descriptions of the same reference numerals, the descriptionmade with reference to FIG. 5 will be used instead.

Referring to FIG. 12 , in the flexible circuit board 410, the firstsignal line 5221 and the second signal line 5222 may be disposedadjacent to each other, and the power line 5121 may be disposed throughthe slit 1260 so as to be spaced apart from the first signal line 5221and the second signal line 5222.

According to an embodiment, the flexible circuit board 410 may includefirst multiple layers 510 including the power line 5121, and secondmultiple layers 1250 including the first signal line 5221 and the secondsignal line 5222.

According to an embodiment, slits 1260 may be formed between the firstsignal line 5221 and the second signal line 5222 and the power line5121. For example, a slit 1260 may be disposed between the firstmultiple layers 510 and the second multiple layers 1250. According to anembodiment, the slit 1260 may be formed through a punching process thatis the same as or similar to the punching process as described withreference to FIG. 6C.

According to an embodiment, the first multiple layers 510 may include afirst upper conductive layer 1202 including a power line 5121, a firstinsulating layer 511, and a first lower conductive layer 1203. Accordingto an embodiment, a first upper cover layer 1111 may be formed in thefirst direction {circle around (1)} from the first upper conductivelayer 1202, and a first lower cover layer 1121 may be formed in thesecond direction {circle around (2)} from the first lower conductivelayer 1203.

According to an embodiment, the second multiple layers 1250 may includea first intermediate conductive layer 1201 on which the first signalline 5221 and the second signal line 5222 are formed, a second upperconductive layer 1202 formed in the first direction {circle around (1)}from the intermediate conductive layer 1201 and electrically connectedto a ground, and a second lower conductive layer 1203 formed in thesecond direction {circle around (2)} opposite to the first direction{circle around (1)} from the intermediate conductive layer 1201 andelectrically connected to a ground.

According to an embodiment, the intermediate conductive layer 1201 mayfurther include a first ground pattern 12011 formed in a third direction(e.g., the left direction in FIG. 12 ) from the first signal line 5221,a second ground pattern 12012 formed in a fourth direction (e.g., theright direction in FIG. 12 ) opposite to the third direction from thefirst signal line 5221, and a third ground pattern 12013 formed in afourth direction from the second signal line 5222. According to anembodiment, the second ground pattern 12012 may be disposed between thefirst signal line 5221 and the second signal line 5222. According to anembodiment, the third and fourth directions may be perpendicular to thefirst direction {circle around (1)} or the second direction {circlearound (2)}.

According to an embodiment, the second multiple layers 1250 may furtherinclude a first intermediate insulating layer 1204 formed between theintermediate conductive layer 1201 and the second upper conductive layer1202, and the second intermediate insulating layer 1205 formed betweenthe intermediate conductive layer 1201 and the second lower conductivelayer 1203.

According to an embodiment, the second multiple layers 1250 may furtherinclude a second upper cover layer 1112 formed in the first direction{circle around (1)} from the second upper conductive layer 1202, and asecond lower cover layer 1122 formed in the second direction {circlearound (2)} from the second lower conductive layer 1203.

According to an embodiment, the second multiple layers 1250 may furtherinclude a plurality of vias 1231, 1232, and 1233 penetrating the firstintermediate insulating layer 1204 and the second intermediateinsulating layer 1205 and electrically connecting the second upperconductive layer 1202 and the second lower conductive layer 1203 to eachother. According to an embodiment, the plurality of vias 1231, 1232, and1233 may include a first via 1231 formed in the third direction (e.g.,the left direction in FIG. 12 ) from the first signal line 5221, asecond via 1232 formed in the fourth direction opposite to the thirddirection from the first signal line 5221, and a third via 1233 formedin the fourth direction from the second signal line 5222. According toan embodiment, the second via 1232 may be disposed between the firstsignal line 5221 and the second signal line 5222.

FIG. 13 is a cross-sectional view of a flexible circuit board 410according to various embodiments.

The flexible circuit board 410 illustrated in FIG. 13 may be at leastpartially similar to or different from the first flexible circuit board410 illustrated in FIG. 5 , or may further include various embodiments.

Hereinafter, portions that have changed from the embodiment of FIG. 5will be described with reference to FIG. 13 . In FIG. 13 , the samereference numerals are used for the same components as those of FIG. 5 ,and for the descriptions of the same reference numerals, the descriptionmade with reference to FIG. 5 will be used instead.

Referring to FIG. 13 , in the flexible circuit board 410, the firstsignal line 5221 and the second signal line 5222 may be disposedadjacent to each other, and the power line 5121 may be disposed throughthe slit so as to be spaced apart from the first signal line 5221 andthe second signal line 5222.

According to an embodiment, the flexible circuit board 410 may includefirst multiple layers 510 including the power line 5121, and secondmultiple layers 1350 including the first signal line 5221 and the secondsignal line 5222.

According to an embodiment, slits 1340 may be formed between the firstsignal line 5221 and the second signal line 5222 and the power line5121. For example, a slit 1340 may be disposed between the firstmultiple layers 510 and the second multiple layers 1350. According to anembodiment, the slit 1340 may be formed through a punching process thatis the same as or similar to the punching process as described withreference to FIG. 6C.

According to an embodiment, the first multiple layers 510 may include afirst upper conductive layer 512 including a power line 5121, a firstinsulating layer 511, and a first lower conductive layer 513. Accordingto an embodiment, a first upper cover layer 1111 may be formed in thefirst direction {circle around (1)} from the first upper conductivelayer 512, and a first lower cover layer 1211 may be formed in thesecond direction {circle around (2)} from the first lower conductivelayer 513.

According to an embodiment, the second multiple layers 1350 may includea second upper conductive layer 522 on which the first signal line 5221and the second signal line 5222 are formed, a second insulating layer521, and a second lower conductive layer 523.

According to an embodiment, the second upper conductive layer 522 mayfurther include a first ground pattern 1341 formed in a third direction(e.g., the left direction in FIG. 13 ) from the first signal line 5221,a second ground pattern 1342 formed in a fourth direction (e.g., theright direction in FIG. 13 ) opposite to the third direction from thefirst signal line 5221, and a third ground pattern 1343 formed in afourth direction from the second signal line 5222. According to anembodiment, the second ground pattern 1342 may be disposed between thefirst signal line 5221 and the second signal line 5222. According to anembodiment, the third and fourth directions may be perpendicular to thefirst direction {circle around (1)} or the second direction {circlearound (2)}.

According to an embodiment, the second multiple layers 1350 may furtherinclude a second upper cover layer 1312 formed in the first direction{circle around (1)} from the second upper conductive layer 522, and asecond lower cover layer 1122 formed in the second direction {circlearound (2)} from the second lower conductive layer 523.

According to an embodiment, the second multiple layers 1350 may furtherinclude a plurality of vias 1331, 1332, and 1333 penetrating the secondinsulating layer 521 and electrically connecting the second upperconductive layer 522 and the second lower conductive layer 523 to eachother. According to an embodiment, the plurality of vias 1331, 1332, and1333 may include a first via 1331 formed in the third direction (e.g.,the left direction in FIG. 12 ) from the first signal line 5221, asecond via 1332 formed in the fourth direction opposite to the thirddirection from the first signal line 5221, and a third via 1333 formedin the fourth direction from the second signal line 5222. According toan embodiment, the second via 1332 may be disposed between the firstsignal line 5221 and the second signal line 5222.

With the flexible circuit board 410 according to various embodiments, itis possible to increase the thickness of the power line (e.g., 5121 inFIG. 5 ) while maintaining impedance matching of the signal lines (e.g.,5221 and 5222 in FIG. 5 ), thereby enabling high power transmission.

With the flexible circuit board 410 according to various embodiments, itis possible to facilitate a design for low heat generation due to adecrease in DC resistance of the power line 5121.

With the flexible circuit board 410 according to various embodiments, itis possible to design the signal lines (e.g., the first signal line 5221and the second signal line 5222 in FIG. 5 ) and the power line 5121 tohave different thicknesses. Therefore, it is easy to reduce thethickness of the signal lines 5221 and 5222, and it is possible tomanufacture the flexible circuit board 410 in a thin shape.

While the disclosure has been illustrated and described with referenceto various example embodiments, it will be understood that the variousexample embodiments are intended to be illustrative, not limiting. Itwill be further understood by those skilled in the art that variouschanges in form and detail may be made without departing from the truespirit and full scope of the disclosure, including the appended claimsand their equivalents.

The invention claimed is:
 1. An electronic device comprising: a flexiblecircuit board configured to transmit a signal in a high-frequency band,wherein the flexible circuit board includes: first multiple layersincluding a power line configured to transmit power, and second multiplelayers stacked in a first direction of the first multiple layers andincluding a first signal line and a second signal line configured totransmit a signal in the high-frequency band, the first multiple layersincluding a first punched region in which at least a portion overlappingthe first signal line and the second signal line is removed, the secondmultiple layers including a second punched region in which at least aportion overlapping the power line is removed, and at least a portion ofthe second punched region and the first punched region overlap eachother forming a slit penetrating the flexible circuit board in the firstdirection.
 2. The electronic device of claim 1, wherein the firstmultiple layers include: a first insulating layer; a first upperconductive layer disposed in the first direction from the firstinsulating layer and including the power line; and a first lowerconductive layer disposed in a second direction opposite the firstdirection from the first insulating layer and including a first lowerground.
 3. The electronic device of claim 2, wherein the second multiplelayers include: a second insulating layer; a second upper conductivelayer disposed in the first direction from the second insulating layerand including the first signal line and the second signal line; and asecond lower conductive layer disposed in the second direction from thesecond insulating layer and including a second lower ground.
 4. Theelectronic device of claim 3, wherein a thickness of the first upperconductive layer is greater than a thickness of the second upperconductive layer such that a thickness of the power line is greater thanthe thicknesses of the first signal line and the second signal line. 5.The electronic device of claim 3, wherein a thickness of the first lowerconductive layer including the first lower ground is greater than athickness of the second lower conductive layer including the secondlower ground.
 6. The electronic device of claim 3, wherein a thicknessof the first insulating layer is less than a thickness of the secondinsulating layer such that an entire thickness of the first multiplelayers is equal to an entire thickness of the second multiple layers. 7.The electronic device of claim 3, wherein the second upper conductivelayer further includes: a plurality of first ground patterns provided atintervals on opposite sides of the first signal line, and a plurality ofsecond ground patterns provided at intervals on opposite sides of thesecond signal line.
 8. The electronic device of claim 7, wherein thesecond multiple layers further include: a plurality of first viaspenetrating the second insulating layer and electrically connecting theplurality of first ground patterns and the second lower ground; and aplurality of second vias penetrating the second insulating layer andelectrically connecting the plurality of second ground patterns and thesecond lower ground.
 9. The electronic device of claim 7, wherein thesecond multiple layers further include: a cover layer disposed in thefirst direction from the second upper conductive layer and covering thefirst signal line and the second signal line; and a shield film disposedin the first direction from the cover layer and electrically connectedto the plurality of first ground patterns and the plurality of secondground patterns by the conductive member.
 10. The electronic device ofclaim 1, wherein the flexible circuit board includes a first surfacefacing the first direction and a second surface facing away from thefirst surface, and the slit is provided between the power line and thefirst signal line and/or between the power line and the second signalline when the first surface is viewed from above.
 11. The electronicdevice of claim 10, wherein the power line is disposed between the firstsignal line and the second signal line when the first surface is viewedfrom above.
 12. The electronic device of claim 10, wherein the secondsignal line is disposed between the first signal line and the power linewhen the first surface is viewed from above.
 13. A flexible circuitboard configured to transmit a signal in a high-frequency band, theflexible circuit board comprising: first multiple layers including apower line configured to transmit power; and second multiple layersstacked in a first direction of the first multiple layers and includinga first signal line and a second signal line configured to transmit asignal in the high-frequency band, wherein the first multiple layersinclude a first punched region in which at least a portion overlappingthe first signal line and the second signal line is removed, the secondmultiple layers include a second punched region in which at least aportion overlapping the power line is removed, and at least a portion ofthe second punched region and the first punched region overlap eachother to provide a slit penetrating the flexible circuit board in thefirst direction.
 14. The flexible circuit board of claim 13, wherein thefirst multiple layers include: a first insulating layer; a first upperconductive layer disposed in the first direction from the firstinsulating layer and including the power line; and a first lowerconductive layer disposed in a second direction opposite the firstdirection from the first insulating layer and including a first lowerground.
 15. The flexible circuit board of claim 14, wherein the secondmultiple layers include: a second insulating layer; a second upperconductive layer disposed in the first direction from the secondinsulating layer and including the first signal line and the secondsignal line; and a second lower conductive layer disposed in the seconddirection from the second insulating layer and including a second lowerground.